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ID:47542719
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页数:9页
时间:2019-09-17
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1、....ATTACHMENT:SAMPLEPREPARATIONINSTRUCTIONS附件:样品准备说明General总述SAMPLEPREPARATIONPreparesamplesbysubjectingthemtoALLoperationsofthespecifiedprocess.样品准备-准备之样品必须经受所有的指定的工艺流程·Includealletching,bakingandcuringsteps.包括所有蚀刻,烘烤和干燥过程。·Exposethesamplestoallmaximumtimes,tem
2、peraturesandpressures.使样品经受所有的最长时间,最高温度和最大压力。·Subjectsamplestothemaximumnumberofcyclesspecifiedinanystep.使样品经受任何指定步骤中的最多次循环。PartA章节ABDSAMPLES–Makecertaintheconductorpatternwhichyouusetobuildthesamplesreflectyourratingrequirements.Theseinclude:BD样品-务必确定样品的导线分布反映您所要
3、求的等级,包括:·minimumcopperthickness最小铜厚·minimumconductorwidths最小导线宽度·maximumunpierceddiameter最大区域直径·minimumthicknessoflaminate基材最小厚度Wewillassignpatternlimitsbasedonactualmeasurementsofthetestsamples.我们将根据您所提供的测试样品的实际尺寸来标定样品规格界限。AttachmentT1,takenfromtheStandardforPrin
4、tedWiringBoards,UL796,Figure10.1,illustratesatypicaltestpattern.Thetestpatternshouldappearonbothsidesofthesamples,onesidebeingthemirrorimageoftheother.IfyoudesireRecognitionforsinglesidedprintedwiringboardsonly,thetestpatternonlyneedappearononesideofthesamples.附件
5、T1,取自印刷线路板标准-UL796,图10.1,图示为典型的样品测试式样。若为双面板,则双面的布线式样应互为镜像。若为单面板,则仅有一面为此布线式样。Ifthemaximumunpierceddiameterwon'tfitonthetestpattern,pleaseprovideaseparatesetofsamples.Youmayetchtheseintoeitheracircleorasquare.SeeFigure10.3.若最大直径区域在附件T1样品图中无法容下,请另外准备一组体现最大直径的样品。可以蚀刻成
6、圆形或者正方形。参见图10.3。资料整理....COPPERTHICKNESSIfyouplantobuycoppercladlaminatewithaminimumcopperthicknessoflessthan34microns(1oz./squarefoot),youshouldplateyoursamplesto34micronsfortestingpurposes.铜厚-若您将要使用的覆铜基材的铜厚小于34微米,则为了测试需要,请将您的样品铜厚镀至34微米。Inproduction,ifyouplantopl
7、atecoppertomorethan102micronsthick(3oz./squarefoot),pleaseprovideanextrasetofsamplesbuiltuptoyourmaximumcopperthickness.在实际生产中,若您使用的铜箔厚度超过102微米,请另外提供一组符合您最大铜厚的样品。MULTILAYERCONSTRUCTIONFormultilayerboards,youmustusethesameconductorpatternontheexternalandinternalla
8、yers.Positiontheunpiercedareasdirectlyovereachother.多层板结构-对于多层板,在内外层上都必须使用相同的导线分布式样。最大直径区域应互相覆盖。Werequiretheconstructiontoincludetwoormoreinternalconduc
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