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1、芯片制造工艺与芯片测试展讯通信–人力资源部–培训与发展组9/29/20211展讯通信-人力资源部-培训与发展组芯片的制造工艺1IC产业链2Wafer的加工过程3IC的封装过程4芯片的测试芯片工艺制造小结9/29/20212一、IC产业链IC应用硅片掩膜半导体设备材料厂商IP/设计服务IC设计ICIC掩膜数据用户需求WaferCPWafer加工封装Test交货成品中测9/29/20213半导体圆柱单晶硅的生长过程制备Wafer9/29/20214二、Wafer加工过程9/29/20215光刻Photolithography9/29/202161.Wafer
2、prepare,deepNwelllithoandimpl.DeepNwell二、Wafer加工过程9/29/20217DeepNwell二、Wafer加工过程2.Padoxide,nitridedeposit,diffusionlitho,trenchetch9/29/20218DeepNwell3.Trenchoxide,litho,etchandCMP;Nitrideremoveandsacoxide二、Wafer加工过程9/29/20219DeepNwell4.Pwelllitho,impl.,VTNimpl.二、Wafer加工过程9/29/20
3、2110DeepNwell5.Nwelllitho,impl.;VTPphoto,impl.二、Wafer加工过程9/29/202111DeepNwell二、Wafer加工过程6.Sacoxideremove,gate1oxideandlitho,gate2oxide9/29/202112DeepNwell7.Polydeposit,litho,andetch;NLDDphotoandimpl.;PLDDphotoandimpl.;Spacerdep.andetch二、Wafer加工过程9/29/202113DeepNwell8.N+S/Dphotoan
4、dimpl.;P+S/Dphotoandimpl.二、Wafer加工过程9/29/202114DeepNwell二、Wafer加工过程9.RPOdeposit,photoandetch;Salicideformation9/29/202115DeepNwell二、Wafer加工过程10.ILDdep.andCMP9/29/202116DeepNwell二、Wafer加工过程11.Contphotoandetch;Wdep.andCMP9/29/202117DeepNwell二、Wafer加工过程12.Met1dep.,photoandetch9/29/2
5、02118DeepNwell二、Wafer加工过程13.Via1,Met2,Via2,Met3,Via3,Met4,CTM4,Via4,TME9/29/202119DeepNwell二、Wafer加工过程14.Passivationdep.,photo,andetch;Alloy9/29/2021209/29/202121封装流程三、IC封装过程9/29/202122BACKGRINDING晶圆背面研磨WAFER…WAFERTRUCKTABLEGRINDINGWHEEL三、IC封装过程9/29/202123WAFERWAFERSAW晶圆切割WAFERMO
6、UNTBLUETAPEDIESAWLADE划片三、IC封装过程9/29/202124DieBond(DieAttach)上片BONDHEADEPOXYSUBSTRATEEPOXYCURE(DIEBONDCURE)三、IC封装过程9/29/202125WireBondGOLDWIRECAPILLARYDIEPADFINGER(INNERLEAD)三、IC封装过程9/29/202126CompoundMoldchaseMoldingGateinsertRunnerTopcullblockCavityTopchaseAirventCompoundPotPlun
7、gerSubstrateBottomcullblockBottomchase三、IC封装过程9/29/202127MarkingINKMARKLASERMARKSPREADTRUMSample20JUNSPREADTRUMSample20JUNSPREADTRUMSample20JUNSPREADTRUMSample20JUN三、IC封装过程9/29/202128BallAttachFLUXFLUXPRINTINGBALLATTACHTOOLBALLATTACHVACUUMSOLDERBALLREFLOW三、IC封装过程9/29/202129PUNCHS
8、ingulationROUTERSPREADTRUMSample20JUNSPR
