高高宽比x射线聚集衍射光学元件分析

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1、高高宽比X射线聚焦衍射光学元件研究具有支撑结构的光子筛版图探索解决图形易倒塌问题。成功制备了X射线聚焦波带片和光子筛的掩模。X射线光刻复制工艺中，在北京和合肥国家同步辐射实验室的光刻站上展开工艺研究，通过控制曝光剂量和显影时间以及微电镀工艺的试验条件，成功制备了高高宽比的波带片和光子筛，并以光子筛为对象深入探索了解决更高高宽比图形制备的全水电镀和旋涂增粘剂等工艺，取得了具有参考价值的实验结果。关键词：X射线衍射光学元件、高高宽比、电子束光刻、X射线光刻IIAbstractAbstractX-rayfocusingdiffractiveopticalelement(DOE)withhigh-

2、aspect-ratioisthekeyelementofhardX-rayimagingsystemwhichiswidelyusedinLaserPlasmasSpatialResolutionDiagnostics(LPSR)andX-rayastronomicaltelescope.AsatypicalrepresentativeofhardX-rayfocusingDOE,FresnelZonePlate(FZP)withhigh-aspect-ratiohasmanyadvantagessuchashighspatialresolutionandwideapplications

3、.Butitsfabricationtechnologyisalwayschallengingtop-downnano-fabrication.Atthesametime,thetheoreticalresearchofanewdiffractiveopticalelement—PhotonSieve(PS)hasbeengivenmoreandmoreattentionbecausethehigherordersofdiffractionandsecondarymaximacanbesuppressedandresolutioncanbeimproved.However,nonehasd

4、evelopedtheprocessforfabricationofhardx-rayfocusingphotonsieve.Inordertomeettheneedsofmajorprojects,theE-beamlithographyandX-raylithographyhavebeencombinedtodeveloptheprocesstechniques.Fresnelzoneplatewith500nmoutermostzonewidth,3.6µmgoldthickness,whichaspectratioisashighas7.2andphotonsievewith350

5、nmoutermostpinholediameter,2.33µmgoldthickness,whichaspectratioisof6.7havebeensuccessfullymanufactured.Thefirstpartofthepaperintroducesimagingprinciple,statusanddevelopmenttrendofFZPandPS.The2ndpartofthepaperdescribesthedetailedprocesstechniquesforfabricatingX-rayFZPandtheX-rayPSwithE-beamlithogra

6、phy,X-raylithographyandelectroplating.BecauseoftheexistenceofLiquidTensionandtheweakadhesionofphotoresistandsubstrate,thehigh-aspect-ratiostructureiseasytocollapsewhichrestrictsthedevelopmentofhardX-rayopticalelements.Inordertosolvetheproblem,alotofexperimentswereimplementedthatincludes:1.Thepolyi

7、midefilmwasfabricatedtoraiseX-raytransmissionrateandprocesstolerance;2.High-resolutionX-rayexposuremaskwasfabricatedwithelectron-beamlithography;3.TheFZPandPSwithhigh-aspect-ratiowerereplicatedbyX-raylithography;