led封装技术简介（led封装技术简介）

《led封装技术简介（led封装技术简介）》由会员上传分享，免费在线阅读，更多相关内容在教育资源-天天文库。

1、led封装技术简介（led封装技术简介）Thispaperiscontributedbylnan6699PdfdocumentsmayexperiencepoorbrowsingontheWAPside.ItisrecommendedthatyouselectTXTfirstordownloadthesourcefiletothelocalmachine.PackagingstepsandtechnicalessentialsofLEDFirst,theproductionprocess1.produc

2、tion:a)cleaning:useultrasoniccleaningPCBorLEDbracket,anddrying.A:b)inLEDtubecore(wafer)bottomelectrodepreparedonsilvercolloidafterexpansion,willexpandafterthetubecore(wafer)placedinthethorncrystalonthestage,willdieapadinstalledinthePCBorLEDsupportcorresp

3、ondingwiththorncrystalpenunderthemicroscopethen,thesinteredsilvergluecuring.(c)pressurewelding:theelectrodeisconnectedtotheLEDcorebyaluminumwireorwirebonder,whichisusedastheleadofcurrentinjection.LEDdirectlyinstalledonthePCB,generallyusingaluminumwirewel

4、dingmachine.(makingwhiteTOP-LEDneedswireweldingmachine)d)package:protecttheLEDcoreandweldingwirewithepoxythroughdispensing.DispensingonthePCBboardhasstrictrequirementsontheshapeofthegelaftercuring,whichisdirectlyrelatedtothebrightnessofthebacklightproduc

5、t.Thisprocesswillalsoundertakethetaskofpointphosphor(whitelightLED).E)welding:ifthebacklightisusingSMD-LEDorotherencapsulatedLED,theLEDshouldbeweldedtothePCBplatebeforeassemblyprocess.F)cuttingfilm:usingapunchpresscuttingbacklightsourceforavarietyofdiffu

6、sionfilm,reflectivefilm,etc..G)assembly:accordingtotherequirementsofthedrawing,thematerialsofthebacklightareinstalledintherightpositionmanually.H)test:checkthephotoelectricparametersofbacklightandtheuniformityoflightemission.2.packaging:thefinishedproduc

7、tpackagingaccordingtotherequirements,warehousing.Two,packagingtechnologyThetaskof1.LEDpackagingistoconnecttheexternalleadtotheelectrodeoftheLEDchip,andprotecttheLEDchipatthesametime,andplayaroleinimprovingtheefficiencyoflightextraction.Thekeyprocessforas

8、sembling,welding,packaging.2.LEDpackagingformLEDpackagingformcanbesaidtobemultifarious,mainlyaccordingtodifferentapplicationoccasionsadoptthecorrespondingshapesize,heatdissipationCountermeasuresLightemissioneffect.Lamp-LED