IC封装大全及世界各大品牌

《IC封装大全及世界各大品牌》由会员上传分享，免费在线阅读，更多相关内容在工程资料-天天文库。

1、IC封装介绍　BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LQFPQuadFlatPackageTQFP100L　SBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackage　CLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2　CPGACeramicPinGridArrayDIPDua

2、lInlinePackage　DIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPSOJ32LSOPEIAJTYPEII14LSOT220SSOP16LSSOPTO18TO220FTO220FlatPackHSOP28ITO220ITO3pJLCCLCCLDCCTO247TO264TO3TO5TO52TO71TO72LGALQFPPCDIPPGAPlasticPinGridArray　PLCCPQFPPSDIPLQFP100LTO78TO8TO92TO93TO99TSOPT

3、hinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayMETALQUAD100LPQFP100LQFPQuadFlatPackageSOT220SOT223SOT223SOT23SOT23/SOT323uBGAMicroBallGridArray　ZIPZig-ZagInlinePackageTEPBGA288LTEPBGA288LC-BendLead CERQUADCeramicQuadFlatPackCera

4、micCaseLAMINATECSP112LChipScalePackageGullWingLeads J-STDJ-STDJointIPC/JEDECSOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackageStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsLLP8LaPCI32bit5VPeripheralComponentInter

5、connectPCI64bit3.3VPeripheralComponentInterconnectPCMCIAPDIPPLCCPS/2PS/2mouseportpinoutSIMM30SIMM30PinoutTO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKET

6、AForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPU　SIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOHICBra

7、nd