IC封装大全及世界各大品牌.docx

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1、IC封装介绍BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserSpecificationRevisionCPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO22OFlatPackHSOP2

2、8QFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackageSOJ32LSOPEIAJTYPEII14LSOT220SSOP16LSSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO92ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LMETA

3、LQUAD100LPQFP100LQFPQuadFlatPackageSOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterTO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig

4、-ZagInlinePackageTEPBGA288LTEPBGA288LC-BendLead?CERQUADCeramicQuadFlatPackCeramicCaseLAMINATECSP112LChipScalePackageGullWingLeads?J-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsLLP8LaPCI32bit5VPeripheralComponentInterconne

5、ctPCI64bitLAMINATETCSP20LChipScalePackageTO252TO263/TO268SODIMMSmallOutlineDualInlineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPent

6、iumCPUPeripheralComponentInterconnectPCMCIAPDIPPLCCPS/2PS/2mouseportpinoutSIMM30SIMM30PinoutSIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAFo

7、rAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOHICBrand